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1. 
Cover image for Diffusion in materials : DIMAT 2004 : proceedings of the 6th International Conference on Diffusion in Materials Cracow, Poland, July 18-23, 2004
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Cover image for Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment
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Cover image for Advances in topological quantum field theory
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Cover image for Metallic materials with high structural efficiency
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Cover image for Smart sensors and MEMS
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Cover image for Physics of laser crystals
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Cover image for Molecular electronics : bio-sensors and bio-computers
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Cover image for Current problems of hydrogeology in urban areas, urban agglomerates, and industrial centres
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Cover image for Hydrogen materials science and chemistry of metal hydrides
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Cover image for High-Tc superconductors and related materials : material science, fundamental properties, and some future electronic applications
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Cover image for Hydroinformatics tools for planning, design, operation and rehabilitation of sewer systems
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Cover image for Transboundary water resources management : institutional and engineering approaches