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1. 
Cover image for Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
2. 
Cover image for Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
3. 
Cover image for Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
4. 
Cover image for Integration of damage-based models for fatigue of solder interconnects
5. 
Cover image for Ball attach yield improvement-DMAIC approach
6. 
Cover image for Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish
7. 
Cover image for Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish
8. 
Cover image for Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold
9. 
Cover image for Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish
10. 
Cover image for Classical and damage mechanics-based models for lead-free solder interconnects
11. 
Cover image for Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish
12. 
Cover image for Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish
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