MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS

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Title:

Personal Author:

McKeown, Stephen A., author

Series:

Mechanical engineering ; volume 120

Physical Description:

ix, 355 pages : illustrations ; 24 cm.

ISBN:

9780367399818

Abstract:

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Subject Term:

Electronic packaging

Mechanical engineering

System analysis

Available:*

Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... PSZ JB	30000010372194	TK7870.15 M54 1999	Open Access Book	Book	Searching... Unknown

On Order

Summary

Author Notes

Stephen A. McKeown is a Senior Principal Development Engineer at Lockheed Martin Control Systems, Johnson City, New York. Previously he was a Senior Engineer at Bendix Electrical Components Division, Sidney, New York. He is the author of a number of articles on solder life analysis and other mechanical engineering topics. Mr. McKeown received the B.S. (1977) and M.Eng, (1977) degrees in mechanical engineering from Rensselaer Polytechnic Institute, Troy, New York.

Preface	p. v
Chapter 1 Introduction	p. 1
1.1 Background	p. 1
1.2 Planning the Analysis	p. 13
1.3 Units	p. 22
1.4 Conventions	p. 22
1.5 General Analysis Checklist	p. 23
1.6 References	p. 23
Chapter 2 Analytical Tools	p. 25
2.1 Introduction	p. 25
2.2 Analytical Tools	p. 25
2.3 Summary of Analytical Tools	p. 37
2.4 "Seamless" Automation	p. 39
2.5 Analytical Tool Checklist	p. 39
2.6 References	p. 41
Chapter 3 Thermal Performance Analysis	p. 43
3.1 Background	p. 43
3.2 Selection of Analysis Approach	p. 44
3.3 Thermal Configuration	p. 44
3.4 Component (First) Level	p. 46
3.5 PWB/Module (Second) Level	p. 54
3.6 Chassis (Third) Level	p. 61
3.7 Combining All Packaging Levels	p. 76
3.8 Special Thermal Cases	p. 90
3.9 Factors in Recent Developments	p. 94
3.10 Verification	p. 96
3.11 Thermal Analysis Checklist	p. 96
3.12 References	p. 98
Chapter 4 Mechanical Performance Analysis	p. 101
4.1 Background	p. 101
4.2 Selection of Analysis Approach	p. 102
4.3 Mechanical Modeling	p. 102
4.4 Mechanical Dynamics Background	p. 110
4.5 Dynamic Mechanical Analysis	p. 125
4.6 Static Mechanical Analysis	p. 130
4.7 Typical Analyses	p. 133
4.8 Interpretation of Results	p. 156
4.9 Factors in Recent Developments	p. 158
4.10 Verification	p. 159
4.11 Mechanical Analysis Checklist	p. 159
4.12 References	p. 162
Chapter 5 Life Analysis	p. 165
5.1 Background	p. 165
5.2 Solder-Life Analysis	p. 171
5.3 Other Life Analysis	p. 187
5.4 Combined Thermal Cycling and Vibration	p. 192
5.5 Relative Life Analysis	p. 195
5.6 Typical Life Calculations	p. 202
5.7 Factors in Recent Developments	p. 213
5.8 Verification	p. 214
5.9 Life Analysis Checklist	p. 214
5.10 References	p. 217
Chapter 6 Other Analysis	p. 219
6.1 Background	p. 219
6.2 Fire-Resistance Analysis	p. 219
6.3 Pressure Transducer Rupture	p. 234
6.4 Humidity Analysis	p. 242
6.5 Pressure-Drop Analysis	p. 249
6.6 Similarity Considerations	p. 256
6.7 Energy-Based Methods	p. 265
6.8 Factors in Recent Developments	p. 277
6.9 Verification	p. 277
6.10 Other Analysis Checklist	p. 277
6.11 References	p. 282
Chapter 7 Analysis of Test Data	p. 285
7.1 Background	p. 285
7.2 Planning Tests	p. 285
7.3 Data Analysis	p. 292
7.4 Verification	p. 321
7.5 Test Data Analysis Checklist	p. 323
7.6 References	p. 324
Chapter 8 Reporting and Verification	p. 327
8.1 Introduction	p. 327
8.2 Reporting	p. 327
8.3 Verification	p. 333
8.4 Reporting/Verification Checklist	p. 342
8.5 References	p. 344
Appendix A Abbreviations	p. 345
Appendix B Unit Conversions	p. 347
Index	p. 351

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Summary

Summary

Author Notes

Table of Contents