Title:
Damping signature analysis for wire bonding machine condition monitoring
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2000
Subject Term:
Added Conference Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010032521 | TK5102.9 D35 2000 | Closed Access Book | 1:BOOK_ARC | Searching... |
Searching... | 30000010032520 | TK5102.9 D35 2000 | Open Access Book | Proceedings, Conference, Workshop etc. | Searching... |
Searching... | 30000010032519 | TK5102.9 D35 2000 | Open Access Book | Proceedings, Conference, Workshop etc. | Searching... |
Searching... | 30000010032518 | TK5102.9 D35 2000 | Open Access Book | Book | Searching... |
