Cover image for Design and analysis of an active thermal control system for IC package
Title:
Design and analysis of an active thermal control system for IC package
Personal Author:
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2008
Physical Description:
4 pages, p.1-4 : illustrations ; 30 cm

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