Cover image for Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish
Title:
Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish
Personal Author:
Publication Information:
2010
Physical Description:
xvi, 90 p. : ill. ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available in CD-ROM : CP 022903 ra
Subject Term:
Added Author:
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DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

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FKM30000005932 x Closed Access Thesis UTM Project Paper (Closed Access)
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30000010245499 TA418.7 L63 2010 raf Closed Access Thesis UTM Project Paper (Closed Access)
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