Title:
Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish
Personal Author:
Publication Information:
2010
Physical Description:
xvi, 82 p. : ill. ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini
Also available in CD-ROM : CP 022880 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000005959 | XX(644908.2) | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010245529 | TS610 T36 2010 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
