Title:
Analysis of building thermal envelope
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2001
General Note:
Loan on microfilm form only : MFL 11085 ra
DSP_DISSERTATION:
Project Paper (Bachelor of Engineering (Electrical)) - Universiti Teknologi Malaysia, 2001
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000004575951 | TJ163.5.B84 T37 2001 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
