Title:
Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
Personal Author:
Publication Information:
2012
Physical Description:
xxiii, 216 p. : ill. (some col.) ; 30 cm.
General Note:
Also available in CD-ROM : CP 028252 ra
Supervisors : Prof. Dr. Ali Ourdjini, Assoc. Prof. Dr. Astuty Amrin
Subject Term:
Added Corporate Author:
DSP_DISSERTATION:
Thesis (Ph.D (Kejuruteraan Mekanikal)) – Universiti Teknologi Malaysia, 2012
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 32000000001164 | TS610 S585 2012 raf | Closed Access Thesis | UTM PhD Thesis (Closed Access) | Searching... |
Searching... | 30000010277314 | TS610 S585 2012 raf | Closed Access Thesis | UTM PhD Thesis (Closed Access) | Searching... |
Searching... | SPS30000002503 | TS610 S585 2012 raf | Closed Access Thesis | UTM PhD Thesis (Closed Access) | Searching... |
