Title:
The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2006
Physical Description:
1 reel ; negatif ; 35 mm.
General Note:
5 titles on 1 microfilm
Added Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010148009 | MFL 013767 | Non Circulating Microfilm | Microfilm | Searching... |
