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Summary
Summary
The responsibilities of the system engineer are many and varied, especially as they relate to facility design and construction. Successful execution of these responsibilities requires an understanding of the underlying technologies, the applicable quality standards, and the proper methods for achieving them. The Communications Facility Design Handbook is dedicated to providing and supporting that understanding. It examines the tasks and functions of the system engineer and establishes a foundation for designing, installing, operating, and maintaining audio, video, computer, and radio frequency systems and facilities.
Unique in its scope and its approach, The Communications Facility Design Handbook describes the important steps required to take a project from basic design to installation and completion. From the fundamental principles of electronics to details on wiring, from budget analysis to safety considerations, this is your one-stop reference for planning, building, renovating, and operating all types of electronics facilities.
Table of Contents
Chapter 1 Electronics Fundamentals | p. 1 |
Introduction | p. 1 |
Electrical Fundamentals | p. 1 |
Conductors and Insulators | p. 2 |
Direct Current (dc) | p. 3 |
Alternating Current (ac) | p. 3 |
Electronic Circuits | p. 3 |
Circuit Analysis | p. 5 |
AC Circuits | p. 6 |
Power Relationship in AC Circuits | p. 6 |
Complex Numbers | p. 7 |
Phasors | p. 9 |
Per Unit System | p. 10 |
Static Electricity | p. 11 |
Magnetism | p. 11 |
Electromagnetism | p. 12 |
Magnetic Shielding | p. 13 |
Electromagnetic-Radiation Spectrum | p. 13 |
Low-End Spectrum Frequencies (1 to 1000 Hz) | p. 14 |
Low-End Radio Frequencies (1000 to 100 kHz) | p. 14 |
Medium-Frequency Radio (20 kHz to 2 MHz) | p. 15 |
High-Frequency Radio (2 to 30 MHz) | p. 16 |
Very High and Ultrahigh Frequencies (30 MHz to 3 GHz) | p. 16 |
Microwaves (3 to 300 GHz) | p. 16 |
Infrared, Visible, and Ultraviolet Light | p. 17 |
X-Rays | p. 17 |
Passive Circuit Components | p. 17 |
Resistors | p. 17 |
Wire-Wound Resistor | p. 17 |
Metal Film Resistor | p. 19 |
Carbon Film Resistor | p. 20 |
Carbon Composition Resistor | p. 21 |
Control and Limiting Resistors | p. 21 |
Resistor Networks | p. 21 |
Adjustable Resistors | p. 22 |
Attenuators | p. 23 |
Capacitors | p. 23 |
Polarized Capacitors | p. 23 |
Nonpolarized Capacitors | p. 25 |
Film Capacitors | p. 25 |
Foil Capacitors | p. 25 |
Electrolytic Capacitors | p. 26 |
Ceramic Capacitors | p. 26 |
Polarized-Capacitor Construction | p. 26 |
Aluminum Electrolytic Capacitors | p. 27 |
Tantalum Electrolytic Capacitors | p. 27 |
Inductors and Transformers | p. 28 |
Losses in Inductors and Transformers | p. 28 |
Air-Core Inductors | p. 29 |
Ferromagnetic Cores | p. 29 |
Shielding | p. 30 |
Diodes and Rectifiers | p. 30 |
The pn Junction | p. 32 |
Zener Diodes and Reverse Breakdown | p. 32 |
Current Regulators | p. 33 |
Varistor | p. 33 |
Indicators | p. 34 |
Active Circuit Components | p. 35 |
Vacuum Tubes | p. 36 |
Bipolar Transistors | p. 36 |
NPN and PNP Transistors | p. 38 |
Transistor Impedance and Gain | p. 38 |
Transistor Configurations | p. 39 |
Switching and Inductive-Load Ratings | p. 40 |
Noise | p. 41 |
Field-Effect Transistors | p. 42 |
FET Impedance and Gain | p. 43 |
Integrated Circuits | p. 44 |
Digital Integrated Circuits | p. 44 |
Linear Integrated Circuits | p. 45 |
References | p. 45 |
Bibliography | p. 45 |
Chapter 2 Modulation Systems | p. 47 |
Introduction | p. 47 |
Principles of Resonance | p. 49 |
Series Resonant Circuits | p. 49 |
Parallel Resonant Circuits | p. 51 |
Cavity Resonators | p. 52 |
Operating Class | p. 53 |
Amplitude Modulation | p. 55 |
Frequency Modulation | p. 59 |
Modulation Index | p. 59 |
Phase Modulation | p. 64 |
Pulse Modulation | p. 64 |
Digital Modulation Systems | p. 64 |
Pulse Amplitude Modulation | p. 65 |
Pulse Time Modulation | p. 65 |
Pulse Code Modulation | p. 68 |
Delta Modulation | p. 69 |
Digital Coding Systems | p. 69 |
Baseband Digital Pulse Modulation | p. 71 |
Spread Spectrum | p. 72 |
References | p. 74 |
Bibliography | p. 74 |
Chapter 3 Analog and Digital Circuits | p. 77 |
Introduction | p. 77 |
Single-Stage Transistor/FET Amplifier | p. 77 |
Impedance and Gain | p. 79 |
Common-Base or Common-Gate Connection | p. 80 |
Common-Collector or Common-Drain Connection | p. 82 |
Bias and Large Signals | p. 82 |
Operational Amplifiers | p. 84 |
Digital Circuits | p. 88 |
Analog-to-Digital (A/D) Conversion | p. 88 |
Digital-to-Analog (D/A) Conversion | p. 89 |
Combinational Logic | p. 91 |
Boolean Algebra | p. 93 |
Logic Device Families | p. 93 |
Diode-Transistor Logic (DTL) | p. 94 |
Transistor-Transistor Logic (TTL) | p. 94 |
NMOS and PMOS | p. 98 |
Complementary MOS (CMOS) | p. 98 |
Emitter-Coupled Logic (ECL) | p. 98 |
Scaling of Digital Circuit Packages | p. 99 |
Representation of Numbers and Numerals | p. 99 |
Nibble | p. 99 |
Byte | p. 100 |
Word | p. 100 |
Negative Numbers | p. 100 |
Floating Point | p. 100 |
Compare | p. 101 |
Jump | p. 101 |
Errors in Digital Systems | p. 102 |
Error Detection and Correction | p. 102 |
Error Concealment | p. 103 |
References | p. 104 |
Bibliography | p. 104 |
Chapter 4 Systems Engineering | p. 105 |
Introduction | p. 105 |
The System Engineer | p. 105 |
Outside Engineering Contractor | p. 106 |
Design Development | p. 107 |
Level of Detail | p. 108 |
Management Support | p. 109 |
The Project Team | p. 110 |
Executive Management | p. 110 |
Project Manager | p. 111 |
Engineering Manager | p. 114 |
System Engineer | p. 114 |
Budget Requirements Analysis | p. 116 |
Feasibility Study and Technology Assessment | p. 117 |
Project Tracking and Control | p. 117 |
Change Order | p. 118 |
Electronic System Design | p. 119 |
Developing a Flow Diagram | p. 120 |
Estimating Cable Lengths | p. 120 |
Signal Timing Considerations | p. 121 |
Cable Loss and Equalization | p. 123 |
Facility Design | p. 123 |
Preliminary Space Planning | p. 123 |
Design Models and Mockups | p. 125 |
Construction Considerations | p. 126 |
Component Selection and Installation | p. 127 |
Technical Documentation | p. 128 |
Documentation Tracking | p. 129 |
Symbols | p. 129 |
Cross-Referencing Documentation | p. 130 |
Specifications | p. 131 |
Working with the Contractors | p. 131 |
Computer-Based Tools | p. 131 |
Professional Association Directory | p. 132 |
Bibliography | p. 135 |
Chapter 5 Facility Construction Issues | p. 137 |
Introduction | p. 137 |
Facility Grounding | p. 137 |
Planning the Ground System | p. 137 |
Establishing an Earth Ground | p. 138 |
Grounding Interface | p. 138 |
Soil Resistivity | p. 141 |
Chemical Ground Rods | p. 141 |
Ufer Ground System | p. 145 |
Bonding Ground-System Elements | p. 147 |
Cadwelding | p. 148 |
Ground-System Inductance | p. 148 |
Designing a Building Ground System | p. 149 |
Bulkhead Panel | p. 152 |
Bulkhead Grounding | p. 154 |
Checklist for Proper Grounding | p. 156 |
AC Power Distribution and Control | p. 156 |
Utility Service Entrance | p. 160 |
Fault Tolerance as a Design Objective | p. 163 |
Critical System Bus | p. 164 |
Power Distribution Options | p. 166 |
Plant Configuration | p. 166 |
Equipment Rack Enclosures and Devices | p. 169 |
Industry Standard Equipment Enclosures | p. 169 |
Types of Rack Enclosures | p. 171 |
Rack Configuration Options | p. 176 |
Selecting an Equipment Rack | p. 178 |
Equipment Rack Layout | p. 178 |
Cooling Considerations | p. 179 |
Single-Point Ground | p. 180 |
Technical Ground System | p. 181 |
Grounding Conductor Size | p. 186 |
Power-Center Grounding | p. 187 |
Isolation Transformers | p. 187 |
Grounding Equipment Racks | p. 189 |
Computer Floors | p. 192 |
Equipment Cooling | p. 195 |
Heat Transfer Mechanisms | p. 196 |
Conduction | p. 196 |
Convection | p. 197 |
Radiation | p. 197 |
The Physics of Boiling Water | p. 198 |
Application of Cooling Principles | p. 200 |
Forced-Air Cooling Systems | p. 200 |
Air-Handling System | p. 201 |
Air Cooling System Design | p. 203 |
Case 1 | p. 204 |
Case 2 | p. 204 |
Case 3 | p. 206 |
Site Design Guidelines | p. 206 |
Closed Site Design | p. 207 |
Open Site Design | p. 208 |
Hybrid Design | p. 210 |
References | p. 211 |
Bibliography | p. 212 |
Chapter 6 Wiring Practices | p. 213 |
Introduction | p. 213 |
Electrical Properties of Conductors | p. 214 |
Effects of Inductance | p. 215 |
Coaxial Cable | p. 215 |
Operating Principles | p. 216 |
Selecting Coaxial Cable | p. 217 |
Cable Characteristics | p. 217 |
Shield | p. 218 |
Signal Loss | p. 219 |
Cable Jacket | p. 220 |
Cable-Rating Standards | p. 220 |
Installing Coaxial Cable | p. 221 |
Installation Considerations | p. 223 |
Equipment Interconnection Issues | p. 224 |
Active-Balanced Input Circuit | p. 224 |
Active-Balanced Output Circuit | p. 227 |
Analyzing Noise Currents | p. 228 |
Grounding Signal-Carrying Cables | p. 230 |
Types of Noise | p. 230 |
Electrostatic Noise | p. 231 |
Electromagnetic Noise | p. 232 |
Skin Effect | p. 233 |
Patch-Bay Grounding | p. 235 |
Video Patch Panel | p. 236 |
Computer Networks | p. 237 |
Physical Layer | p. 238 |
Installation Considerations | p. 239 |
Data Link Layer | p. 239 |
Installation Considerations | p. 240 |
Network Layer | p. 240 |
Installation Considerations | p. 240 |
Transport Layer | p. 241 |
Installation Considerations | p. 241 |
Session Layer | p. 241 |
Installation Considerations | p. 241 |
Presentation Layer | p. 242 |
Installation Considerations | p. 242 |
Application Layer | p. 242 |
Installation Considerations | p. 242 |
Transmission System Options | p. 242 |
System Design Alternatives | p. 243 |
Frequency Division Multiplexing | p. 243 |
Time Division Multiplexing | p. 243 |
Wave(length) Division Multiplexing | p. 244 |
Selecting Cable for Digital Signals | p. 244 |
Data Patch Panel | p. 245 |
Optical Cable | p. 247 |
Types of Fibers | p. 247 |
Step Index Multi-mode Fiber | p. 247 |
Step Index Single (Mono)-Mode Fiber | p. 248 |
Graded Index Multi-mode Fiber | p. 248 |
Characteristics of Attenuation | p. 249 |
Types of Cable | p. 250 |
Breakout Design | p. 250 |
MFPT, Central Loose Tube Design | p. 251 |
MFPT, Stranded Loose Tube Design | p. 251 |
SFPT, Stranded Loose Tube Design | p. 251 |
Star, or Slotted Core, Design | p. 252 |
Tight Tube, or Stuffed, Design | p. 253 |
Application Considerations | p. 253 |
Specifying Fiber-Optic Cable | p. 254 |
Installation Specifications | p. 255 |
Environmental Specifications | p. 257 |
Cabling Hardware | p. 257 |
Cable Ties | p. 258 |
Braided Sleeving | p. 259 |
Cable Identification and Marking | p. 261 |
Wire Markers | p. 261 |
Wrap-Around Adhesive Tape Wire Markers | p. 262 |
Write-On Cable Ties | p. 262 |
Cable Connectors | p. 262 |
BNC Connector | p. 262 |
Dual Crimp-Type Connectors | p. 263 |
Screw-Type Connector | p. 263 |
Twisted Pair Connectors | p. 265 |
Audio Connectors | p. 265 |
Data Connectors | p. 265 |
Terminal Blocks | p. 266 |
Fiber Optic Connectors | p. 267 |
Connector Properties | p. 269 |
Performance Considerations | p. 271 |
Bibliography | p. 271 |
Chapter 7 System Reliability | p. 273 |
Introduction | p. 273 |
Terminology | p. 273 |
Quality Assurance | p. 275 |
Inspection Process | p. 276 |
Reliability Evaluation | p. 276 |
Parts-Count Method | p. 277 |
Stress-Analysis Method | p. 277 |
Failure Analysis | p. 277 |
Standardization | p. 279 |
Reliability Analysis | p. 280 |
Statistical Reliability | p. 280 |
Roller-Coaster Hazard Rate | p. 282 |
Environmental Stress Screening | p. 283 |
Latent Defects | p. 287 |
Operating Environment | p. 289 |
Failure Modes | p. 289 |
Maintenance Considerations | p. 290 |
Common-Mode Failure | p. 290 |
Spare Parts | p. 291 |
ISO 9000 Series | p. 291 |
Disaster Preparedness Issues | p. 291 |
Emergency Situations | p. 291 |
The Planning Process | p. 292 |
Identifying Realistic Risks | p. 293 |
Alternate Sites | p. 294 |
Standby Power Options | p. 294 |
Batteries | p. 299 |
Plan Ahead | p. 300 |
References | p. 300 |
Bibliography | p. 300 |
Chapter 8 Safety Considerations | p. 301 |
Introduction | p. 301 |
Facility Safety Equipment | p. 301 |
A Systems Approach to Safety | p. 304 |
Electric Shock | p. 304 |
Effects on the Human Body | p. 305 |
Circuit Protection Hardware | p. 306 |
Three-Phase Systems | p. 307 |
Working with High Voltage | p. 310 |
RF Considerations | p. 311 |
First Aid Procedures | p. 312 |
Operating Hazards | p. 312 |
OSHA Safety Considerations | p. 314 |
Protective Covers | p. 314 |
Identification and Marking | p. 315 |
Extension Cords | p. 316 |
Grounding | p. 316 |
Beryllium Oxide Ceramics | p. 318 |
Corrosive and Poisonous Compounds | p. 318 |
FC-75 Toxic Vapor | p. 319 |
Nonionizing Radiation | p. 319 |
NEPA Mandate | p. 320 |
Revised Guidelines | p. 321 |
Multiple-User Sites | p. 322 |
Operator Safety Considerations | p. 322 |
X-Ray Radiation Hazard | p. 323 |
Implosion Hazard | p. 323 |
Hot Coolant and Surfaces | p. 323 |
Polychlorinated Biphenyls | p. 323 |
Governmental Action | p. 325 |
PCB Components | p. 325 |
PCB Liability Management | p. 327 |
Management Responsibility | p. 328 |
References | p. 329 |
Bibliography | p. 329 |
Chapter 9 Dictionary | p. 331 |
Chapter 10 Reference Data and Tables | p. 391 |
Standard Units | p. 391 |
Standard Prefixes | p. 392 |
Common Standard Units | p. 393 |
Conversion Reference Data | p. 394 |
Reference Tables | p. 414 |
International Standards and Constants | p. 425 |
Resistive Properties | p. 433 |
Dielectrics and Semiconductors | p. 443 |
Magnetic Properties | p. 447 |
Properties of Selected Materials | p. 451 |
References | p. 454 |
Index | p. 455 |