Cover image for Communications facility design handbook
Title:
Communications facility design handbook
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Publication Information:
Boca Raton : CRC Press, 2001
ISBN:
9780849309083
General Note:
Also available in online version from EngnetBase
Electronic Access:
Online access via EngnetBase

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30000004841296 TK7870 W54 2000 Open Access Book Book
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Summary

Summary

The responsibilities of the system engineer are many and varied, especially as they relate to facility design and construction. Successful execution of these responsibilities requires an understanding of the underlying technologies, the applicable quality standards, and the proper methods for achieving them. The Communications Facility Design Handbook is dedicated to providing and supporting that understanding. It examines the tasks and functions of the system engineer and establishes a foundation for designing, installing, operating, and maintaining audio, video, computer, and radio frequency systems and facilities.

Unique in its scope and its approach, The Communications Facility Design Handbook describes the important steps required to take a project from basic design to installation and completion. From the fundamental principles of electronics to details on wiring, from budget analysis to safety considerations, this is your one-stop reference for planning, building, renovating, and operating all types of electronics facilities.


Table of Contents

Chapter 1 Electronics Fundamentalsp. 1
Introductionp. 1
Electrical Fundamentalsp. 1
Conductors and Insulatorsp. 2
Direct Current (dc)p. 3
Alternating Current (ac)p. 3
Electronic Circuitsp. 3
Circuit Analysisp. 5
AC Circuitsp. 6
Power Relationship in AC Circuitsp. 6
Complex Numbersp. 7
Phasorsp. 9
Per Unit Systemp. 10
Static Electricityp. 11
Magnetismp. 11
Electromagnetismp. 12
Magnetic Shieldingp. 13
Electromagnetic-Radiation Spectrump. 13
Low-End Spectrum Frequencies (1 to 1000 Hz)p. 14
Low-End Radio Frequencies (1000 to 100 kHz)p. 14
Medium-Frequency Radio (20 kHz to 2 MHz)p. 15
High-Frequency Radio (2 to 30 MHz)p. 16
Very High and Ultrahigh Frequencies (30 MHz to 3 GHz)p. 16
Microwaves (3 to 300 GHz)p. 16
Infrared, Visible, and Ultraviolet Lightp. 17
X-Raysp. 17
Passive Circuit Componentsp. 17
Resistorsp. 17
Wire-Wound Resistorp. 17
Metal Film Resistorp. 19
Carbon Film Resistorp. 20
Carbon Composition Resistorp. 21
Control and Limiting Resistorsp. 21
Resistor Networksp. 21
Adjustable Resistorsp. 22
Attenuatorsp. 23
Capacitorsp. 23
Polarized Capacitorsp. 23
Nonpolarized Capacitorsp. 25
Film Capacitorsp. 25
Foil Capacitorsp. 25
Electrolytic Capacitorsp. 26
Ceramic Capacitorsp. 26
Polarized-Capacitor Constructionp. 26
Aluminum Electrolytic Capacitorsp. 27
Tantalum Electrolytic Capacitorsp. 27
Inductors and Transformersp. 28
Losses in Inductors and Transformersp. 28
Air-Core Inductorsp. 29
Ferromagnetic Coresp. 29
Shieldingp. 30
Diodes and Rectifiersp. 30
The pn Junctionp. 32
Zener Diodes and Reverse Breakdownp. 32
Current Regulatorsp. 33
Varistorp. 33
Indicatorsp. 34
Active Circuit Componentsp. 35
Vacuum Tubesp. 36
Bipolar Transistorsp. 36
NPN and PNP Transistorsp. 38
Transistor Impedance and Gainp. 38
Transistor Configurationsp. 39
Switching and Inductive-Load Ratingsp. 40
Noisep. 41
Field-Effect Transistorsp. 42
FET Impedance and Gainp. 43
Integrated Circuitsp. 44
Digital Integrated Circuitsp. 44
Linear Integrated Circuitsp. 45
Referencesp. 45
Bibliographyp. 45
Chapter 2 Modulation Systemsp. 47
Introductionp. 47
Principles of Resonancep. 49
Series Resonant Circuitsp. 49
Parallel Resonant Circuitsp. 51
Cavity Resonatorsp. 52
Operating Classp. 53
Amplitude Modulationp. 55
Frequency Modulationp. 59
Modulation Indexp. 59
Phase Modulationp. 64
Pulse Modulationp. 64
Digital Modulation Systemsp. 64
Pulse Amplitude Modulationp. 65
Pulse Time Modulationp. 65
Pulse Code Modulationp. 68
Delta Modulationp. 69
Digital Coding Systemsp. 69
Baseband Digital Pulse Modulationp. 71
Spread Spectrump. 72
Referencesp. 74
Bibliographyp. 74
Chapter 3 Analog and Digital Circuitsp. 77
Introductionp. 77
Single-Stage Transistor/FET Amplifierp. 77
Impedance and Gainp. 79
Common-Base or Common-Gate Connectionp. 80
Common-Collector or Common-Drain Connectionp. 82
Bias and Large Signalsp. 82
Operational Amplifiersp. 84
Digital Circuitsp. 88
Analog-to-Digital (A/D) Conversionp. 88
Digital-to-Analog (D/A) Conversionp. 89
Combinational Logicp. 91
Boolean Algebrap. 93
Logic Device Familiesp. 93
Diode-Transistor Logic (DTL)p. 94
Transistor-Transistor Logic (TTL)p. 94
NMOS and PMOSp. 98
Complementary MOS (CMOS)p. 98
Emitter-Coupled Logic (ECL)p. 98
Scaling of Digital Circuit Packagesp. 99
Representation of Numbers and Numeralsp. 99
Nibblep. 99
Bytep. 100
Wordp. 100
Negative Numbersp. 100
Floating Pointp. 100
Comparep. 101
Jumpp. 101
Errors in Digital Systemsp. 102
Error Detection and Correctionp. 102
Error Concealmentp. 103
Referencesp. 104
Bibliographyp. 104
Chapter 4 Systems Engineeringp. 105
Introductionp. 105
The System Engineerp. 105
Outside Engineering Contractorp. 106
Design Developmentp. 107
Level of Detailp. 108
Management Supportp. 109
The Project Teamp. 110
Executive Managementp. 110
Project Managerp. 111
Engineering Managerp. 114
System Engineerp. 114
Budget Requirements Analysisp. 116
Feasibility Study and Technology Assessmentp. 117
Project Tracking and Controlp. 117
Change Orderp. 118
Electronic System Designp. 119
Developing a Flow Diagramp. 120
Estimating Cable Lengthsp. 120
Signal Timing Considerationsp. 121
Cable Loss and Equalizationp. 123
Facility Designp. 123
Preliminary Space Planningp. 123
Design Models and Mockupsp. 125
Construction Considerationsp. 126
Component Selection and Installationp. 127
Technical Documentationp. 128
Documentation Trackingp. 129
Symbolsp. 129
Cross-Referencing Documentationp. 130
Specificationsp. 131
Working with the Contractorsp. 131
Computer-Based Toolsp. 131
Professional Association Directoryp. 132
Bibliographyp. 135
Chapter 5 Facility Construction Issuesp. 137
Introductionp. 137
Facility Groundingp. 137
Planning the Ground Systemp. 137
Establishing an Earth Groundp. 138
Grounding Interfacep. 138
Soil Resistivityp. 141
Chemical Ground Rodsp. 141
Ufer Ground Systemp. 145
Bonding Ground-System Elementsp. 147
Cadweldingp. 148
Ground-System Inductancep. 148
Designing a Building Ground Systemp. 149
Bulkhead Panelp. 152
Bulkhead Groundingp. 154
Checklist for Proper Groundingp. 156
AC Power Distribution and Controlp. 156
Utility Service Entrancep. 160
Fault Tolerance as a Design Objectivep. 163
Critical System Busp. 164
Power Distribution Optionsp. 166
Plant Configurationp. 166
Equipment Rack Enclosures and Devicesp. 169
Industry Standard Equipment Enclosuresp. 169
Types of Rack Enclosuresp. 171
Rack Configuration Optionsp. 176
Selecting an Equipment Rackp. 178
Equipment Rack Layoutp. 178
Cooling Considerationsp. 179
Single-Point Groundp. 180
Technical Ground Systemp. 181
Grounding Conductor Sizep. 186
Power-Center Groundingp. 187
Isolation Transformersp. 187
Grounding Equipment Racksp. 189
Computer Floorsp. 192
Equipment Coolingp. 195
Heat Transfer Mechanismsp. 196
Conductionp. 196
Convectionp. 197
Radiationp. 197
The Physics of Boiling Waterp. 198
Application of Cooling Principlesp. 200
Forced-Air Cooling Systemsp. 200
Air-Handling Systemp. 201
Air Cooling System Designp. 203
Case 1p. 204
Case 2p. 204
Case 3p. 206
Site Design Guidelinesp. 206
Closed Site Designp. 207
Open Site Designp. 208
Hybrid Designp. 210
Referencesp. 211
Bibliographyp. 212
Chapter 6 Wiring Practicesp. 213
Introductionp. 213
Electrical Properties of Conductorsp. 214
Effects of Inductancep. 215
Coaxial Cablep. 215
Operating Principlesp. 216
Selecting Coaxial Cablep. 217
Cable Characteristicsp. 217
Shieldp. 218
Signal Lossp. 219
Cable Jacketp. 220
Cable-Rating Standardsp. 220
Installing Coaxial Cablep. 221
Installation Considerationsp. 223
Equipment Interconnection Issuesp. 224
Active-Balanced Input Circuitp. 224
Active-Balanced Output Circuitp. 227
Analyzing Noise Currentsp. 228
Grounding Signal-Carrying Cablesp. 230
Types of Noisep. 230
Electrostatic Noisep. 231
Electromagnetic Noisep. 232
Skin Effectp. 233
Patch-Bay Groundingp. 235
Video Patch Panelp. 236
Computer Networksp. 237
Physical Layerp. 238
Installation Considerationsp. 239
Data Link Layerp. 239
Installation Considerationsp. 240
Network Layerp. 240
Installation Considerationsp. 240
Transport Layerp. 241
Installation Considerationsp. 241
Session Layerp. 241
Installation Considerationsp. 241
Presentation Layerp. 242
Installation Considerationsp. 242
Application Layerp. 242
Installation Considerationsp. 242
Transmission System Optionsp. 242
System Design Alternativesp. 243
Frequency Division Multiplexingp. 243
Time Division Multiplexingp. 243
Wave(length) Division Multiplexingp. 244
Selecting Cable for Digital Signalsp. 244
Data Patch Panelp. 245
Optical Cablep. 247
Types of Fibersp. 247
Step Index Multi-mode Fiberp. 247
Step Index Single (Mono)-Mode Fiberp. 248
Graded Index Multi-mode Fiberp. 248
Characteristics of Attenuationp. 249
Types of Cablep. 250
Breakout Designp. 250
MFPT, Central Loose Tube Designp. 251
MFPT, Stranded Loose Tube Designp. 251
SFPT, Stranded Loose Tube Designp. 251
Star, or Slotted Core, Designp. 252
Tight Tube, or Stuffed, Designp. 253
Application Considerationsp. 253
Specifying Fiber-Optic Cablep. 254
Installation Specificationsp. 255
Environmental Specificationsp. 257
Cabling Hardwarep. 257
Cable Tiesp. 258
Braided Sleevingp. 259
Cable Identification and Markingp. 261
Wire Markersp. 261
Wrap-Around Adhesive Tape Wire Markersp. 262
Write-On Cable Tiesp. 262
Cable Connectorsp. 262
BNC Connectorp. 262
Dual Crimp-Type Connectorsp. 263
Screw-Type Connectorp. 263
Twisted Pair Connectorsp. 265
Audio Connectorsp. 265
Data Connectorsp. 265
Terminal Blocksp. 266
Fiber Optic Connectorsp. 267
Connector Propertiesp. 269
Performance Considerationsp. 271
Bibliographyp. 271
Chapter 7 System Reliabilityp. 273
Introductionp. 273
Terminologyp. 273
Quality Assurancep. 275
Inspection Processp. 276
Reliability Evaluationp. 276
Parts-Count Methodp. 277
Stress-Analysis Methodp. 277
Failure Analysisp. 277
Standardizationp. 279
Reliability Analysisp. 280
Statistical Reliabilityp. 280
Roller-Coaster Hazard Ratep. 282
Environmental Stress Screeningp. 283
Latent Defectsp. 287
Operating Environmentp. 289
Failure Modesp. 289
Maintenance Considerationsp. 290
Common-Mode Failurep. 290
Spare Partsp. 291
ISO 9000 Seriesp. 291
Disaster Preparedness Issuesp. 291
Emergency Situationsp. 291
The Planning Processp. 292
Identifying Realistic Risksp. 293
Alternate Sitesp. 294
Standby Power Optionsp. 294
Batteriesp. 299
Plan Aheadp. 300
Referencesp. 300
Bibliographyp. 300
Chapter 8 Safety Considerationsp. 301
Introductionp. 301
Facility Safety Equipmentp. 301
A Systems Approach to Safetyp. 304
Electric Shockp. 304
Effects on the Human Bodyp. 305
Circuit Protection Hardwarep. 306
Three-Phase Systemsp. 307
Working with High Voltagep. 310
RF Considerationsp. 311
First Aid Proceduresp. 312
Operating Hazardsp. 312
OSHA Safety Considerationsp. 314
Protective Coversp. 314
Identification and Markingp. 315
Extension Cordsp. 316
Groundingp. 316
Beryllium Oxide Ceramicsp. 318
Corrosive and Poisonous Compoundsp. 318
FC-75 Toxic Vaporp. 319
Nonionizing Radiationp. 319
NEPA Mandatep. 320
Revised Guidelinesp. 321
Multiple-User Sitesp. 322
Operator Safety Considerationsp. 322
X-Ray Radiation Hazardp. 323
Implosion Hazardp. 323
Hot Coolant and Surfacesp. 323
Polychlorinated Biphenylsp. 323
Governmental Actionp. 325
PCB Componentsp. 325
PCB Liability Managementp. 327
Management Responsibilityp. 328
Referencesp. 329
Bibliographyp. 329
Chapter 9 Dictionaryp. 331
Chapter 10 Reference Data and Tablesp. 391
Standard Unitsp. 391
Standard Prefixesp. 392
Common Standard Unitsp. 393
Conversion Reference Datap. 394
Reference Tablesp. 414
International Standards and Constantsp. 425
Resistive Propertiesp. 433
Dielectrics and Semiconductorsp. 443
Magnetic Propertiesp. 447
Properties of Selected Materialsp. 451
Referencesp. 454
Indexp. 455