Limit Search Results
Author
Language
Format
Material Type
Subject
Switch to list view
Switch to thumbnail view
Select an Action
3 Results Found Subscribe to search results
000MAIN
Print
1. 
Cover image for Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
2. 
Cover image for Diffusion bonding as a production process
3. 
Cover image for Diffusion in High-Tech Materials : special topic volume with invited peer reviewed papers only