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Cover image for Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
Title:
Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
Publication Information:
Penang, Malaysia : IEEE CPMT, 2004
ISBN:
9789832514862

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30000010073099 TK7870 I574 2004 Open Access Book Proceedings, Conference, Workshop etc.
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