Cover image for Experimental simulation of thermal conduction in an electronic component
Title:
Experimental simulation of thermal conduction in an electronic component
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2000
Physical Description:
1 reel : negative ; 35mm.
General Note:
5 titles on 1 microfilm
Added Author:
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000

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30000010033981 MFL 10557 Non Circulating Microfilm Microfilm
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