Cover image for Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish
Title:
Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish
Personal Author:
Chong, Phey Shan, 1988-
Publication Information:
2012
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Supervisor : Prof. Dr. Ali Ourdjini

Also available in printed version : TN490.B6 C46 2012 raf
Subject Term:
Bismuth
Added Author:
Ali Ourdjini
Added Corporate Author:
Fakulti Kejuruteraan Mekanikal
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012

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 793036-2002 XX(793036.1) UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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 30000010294444 CP 055087 ra UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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