Cover image for Thermal model for electronic components placement on printed circuit board
Title:
Thermal model for electronic components placement on printed circuit board
Publication Information:
2013
Physical Description:
xiv, 71 p. : ill. ; 30 cm.
General Note:
Also available in CD-ROM : CP 031569 ra

Supervisor : Dr. Fatimah Sham Ismail
Added Corporate Author:
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Elektrik - Mekatronik dan Kawalan Automatik)) - UniversitiTeknologi Malaysia, 2013

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FKE30000006830 TK7868.P7 A59 2013 raf Closed Access Thesis UTM Master Thesis (Closed Access)
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30000010318310 TK7868.P7 A59 2013 raf Closed Access Thesis UTM Master Thesis (Closed Access)
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