Encapsulation technologies for electronic applications

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Title:

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Series:

Materials and processes for electronic applications series

Publication Information:

New York : Applied Science Pub., 2009

Physical Description:

xvii, 480 p. : ill. ; 24 cm.

ISBN:

9780815515760

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Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... PSZ JB	30000010202969	TK7871.15.P5 A72 2009	Open Access Book	Book	Searching... Unknown