The history of electrolytic gold plating starts at the beginning of 19th century. Prior to the emergence of teh electronic industry in the 1940's, most gold electroplating was performed for decorative purposes. With the growth of the electronics industry, however, the need of gold plating for electroniccomponenets have become evident. It is noteworthy that virtually all electronic components in use today relies heavily on electroplating processes. The high electrical conducativity of gold, the low contact resistance and the good solderability makes gold the ideal choice for many items of elecltronic hardware mainly printed circuit boards. Other excellent properties such as btbetter corrosion resisteant, also the reason of why gold electroplating became more important to electronic industry. This thesis project is regarding a study on the effect of ultrasonic agitation on mechanical properties of gold electroplating with lamination of copper and nickel. In this study, the principle and theory of gold plating was discussed in the first few chapters. Then, practical of gold plating was carried out with different combination parameters of pH, temperature and ultrasonic power in the laboratory. Prior to the gold plating, the specimens were first plated with nickel and copper. This was discussed in detail in chapter 6. The gold coating specimens were later subjected to various ty[pes of test such as salt spray test, topography study and so forth. Finally, the result obtained will be discussed and conclusion and recommendations were drawn in chapter 8.