Title:
Study of dissolution nickel layer in enig surface finish during reflow soldering
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2006
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version :
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | FKM30000001281 | CP 13620 | Computer File Accompanies UTM Thesis/Project Paper | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
Searching... | 30000010097685 | CP 13620 ra | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |