Title:
Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
Personal Author:
Publication Information:
2007
Physical Description:
xviii, 97 p. :bill. ; 30 cm.
General Note:
Also available in CD-ROM : CP 021788 ra
Added Author:
Added Corporate Author:
Electronic Access:
Full text thesis via UTM-IR
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Fakulti Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2007
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000004312 | QD515 P36 2007 raf | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
Searching... | 30000010187731 | QD515 P36 2007 raf | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
