Cover image for Finite element simulation of drop impact of printed circuit  board package assembly of generic mobile electronics product
Title:
Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product
Personal Author:
Publication Information:
2007
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Supervisor : Dr. Nazri Kamsah

Also available in printed version : TK7868.P7 C44 2007 raf
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

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30000010143196 CP 020309 ra UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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