Cover image for Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
Title:
Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
Personal Author:
Pang, Hooi San
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2007
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : QD515 P36 2007 raf

Supervisor : Mohd. Nasir Tamin
Subject Term:
Thermal analysis

Expansion (Heat)
Added Corporate Author:
Fakulti Kejuruteraan Mekanikal
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

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 30000010187732 CP 021788 ra UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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