Cover image for Ceramic integration and joining technologies : from macro to nanoscale
Title:
Ceramic integration and joining technologies : from macro to nanoscale
Publication Information:
Hoboken, NJ. : Wiley-American Ceramic Society, 2011.
Physical Description:
xiv, 318 p. : ill. ; 25 cm.
ISBN:
9780470391228
General Note:
Includes index.
Abstract:
"This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators"-- Provided by publisher.
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Summary

Summary

This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.

This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.


Author Notes

Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientist at Ohio Aerospace Institute, NASA Glenn Research Center, and is actively involved in various activities related to processing, manufacturing, joining and attachment technologies. He is Academician of World Academy of Ceramics and Governor of Acta Materialia, Inc. He has authored or coauthored more than two hundred thirty publications, edited forty two books/journal volumes, and holds several patents and technology transfers to industries. He is recipient of numerous (more than forty) national and international awards from all over the world including four R&D 100 awards, NASA Public Service Medal, and NASA Exceptional Space Act Award for outstanding and extraordinary contributions to various NASA programs.

Tatsuki Ohji, PhD, FACerS, is the Prime Senior Research Scientist at Japan's National Institute of Advanced Industrial Science and Technology (AIST). His research interests include characterization of ceramics, ceramic composites and porous materials, design of advanced ceramics, and green ceramic manufacturing. He has authored or coauthored more than 320 scientific papers and nine books, and holds more than forty patents. He is a fellow of the American Ceramic Society, Academician of the World Academy of Ceramics, a Governor of Acta Materialia, Inc., and editorial board member of many international journals.

Rajiv Asthana, PhD, FASM, is a professor at the University of Wisconsin-Stout where he teaches in the manufacturing engineering and engineering technology programs. His research interests include ceramic/metal joining, high-temperature capillarity and cast metal-matrix composites. He is the author or coauthor of four books and 150 refereed papers, an Associate Editor of Journal of Materials Engineering & Performance, guest editor and editorial board member of several refereed journals, and a fellow of ASM International.

Sanjay Mathur, PhD, is professor at the Institute of Inorganic Chemistry at the University of Cologne, Germany. The major research thrust of his group include chemical synthesis of functional nanostructures and their processing for product and device applications. He was an Alexander von Humboldt Fellow at the Saarland University, where he accomplished his Habilitation. He has authored or coauthored over 150 publications, edited a book, holds several patents, and is and Associate Editor of International Journal of Applied Ceramic Technology and Nanomaterials.


Table of Contents

Mrityunjay Singh and Tatsuki Ohji and Rajiv Asthana and Sanjay MathurJolanta Janczak-RuschMonica Ferraris and Milena Salvo and Valentina CasalegnoK. S. Weil and J. T. Darsell and J. Y. KimMichael C. Halbig and Mrityunjay SinghMrityunjay Singh and Rajiv AsthanaV. M. Perevertailo and O. B. LoginovaRichard MatzRyoji Fitnahashi and Saori Urata and Atsuko Kosuga and Delpkine FlahautYoshinobu Fujishiro and Toshio Suzuki and Toshiro Yamaguchi and Koichi Hamamoto and Masanobu Awano and Nigel SammesWoosuck Shin and Maiko Nishibori and Ichiro MatsubaraTalha Erdem and Hilmi Volkan DemirTakashi GotoCher Ming Tan and Yuejin HouAshok Kumar and Supriya Ketkar and Venkataraman GurumurthyJun AkedoYoshitake Masuda and Kunihito KoumotoF. Herndndez-Ramirez and J. D. Trades and A. Romano-Rodriguez and S. Barth and H. Shen and S. MathurXijun Li and Daniel H. C. ChuaD. Pliszka and S. Sundarrajan and S. RamakrishnaC. Jin and W. Wei and R. Aggarwal and R. J. NarayanAtaur Safkar and M. Saif IslamUmur Caglar and Ville Pekkanen and Jani Valkama and Pauliina Mansikkamdki and Jussi PekkanenMasakazu Kawashita and Toshiki Miyazaki and Chikara Ohtsuki
Prefacep. ix
Contributorsp. xi
Part I Introductionp. 1
1 Ceramic Integration Across Length Scales: Technical Issues, Challenges, And Opportunitiesp. 3
Part II Science And Technology For Macroscale Integrationp. 15
2 Ceramic Component Integration By Advanced Brazing Technologiesp. 17
3 Joining And Integration Issues of Ceramic Matrix Composites For The Nuclear Industryp. 39
4 Air Brazing: A New Method of Ceramic-Ceramic And Ceramic-Metal Joiningp. 91
5 Difusion Bonding of Silicon Carbide As An Enabling Technology For The Fabrication of Complex-Shaped Ceramic Componentsp. 143
6 Integration of Carbon-Carbon Composite To Metallic Systems For Thermal Management Applicationsp. 163
7 contact Interaction In Carbon-Metal Systems ForJoining And Integrationp. 193
part III integration Issues In Energy Generation And Device Fabricationp. 231
8 integration Technologies For Ferrites And Power Inductors In Ceramic Circuit Boardsp. 233
9 oxide Thermoelectric Power Generationp. 267
10 integration Technologies For Solid Oxide Fuel Cells (Sofcs) And Other Electrochemical Reactorsp. 297
11 integration Technologies For Sensorsp. 323
12 on-Chip Integration Of Functional Hybrid Materials And Components In Nanophotonics And Optoelectronicsp. 339
13 Integration Of Multifunctional Properties In Thermal Barrier Coatings By Chemical Vapor Depositionp. 393
14 the Changing Physics In Metal Interconnect Reliabilityp. 415
15 integration Issues Of Barium Strontium Titanate Thin Film For Tunable Microwave Applicationsp. 449
16 aerosol Deposition (Ad) Integration Techniques And Their Application To Microdevicesp. 489
part IV nano- And Biointegrationp. 521
17 Advances In Nano Integration Methodologies: Patterning, Positioning, And Self-Assemblyp. 523
18 Integration Of Nanowires In New Devices And Circuit Architectures: Recent Developments And Challengesp. 575
19 Integrating Diamond-Like Carbon Into Nanostructure Designs (Fabricating Microscale And Nanoscale Architectures Of Diamond-Like Carbqn Films)p. 641
20 Synthesis, Properties, Integration, And Applications Of Vertically Aligned Ceramic Nanostructuresp. 671
21 Nanointegration Based On Thin-Film Technologyp. 699
22 mass-Manufacturable Nanowire Integration: Challenges And Recent Developmentsp. 721
23 Usability Of Ink-Jet Printing Technology And Nanomaterials In Electrical Interconnections, Electronic Packaging, And System Integration For Microelectronics Applicationsp. 743
24 biointegration Of Prosthetic Devicesp. 777
Indexp. 803