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Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
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Searching... | 30000010281254 | TA455.C43 C466 2011 | Open Access Book | Book | Searching... |
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Summary
Summary
This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.
This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
Author Notes
Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientist at Ohio Aerospace Institute, NASA Glenn Research Center, and is actively involved in various activities related to processing, manufacturing, joining and attachment technologies. He is Academician of World Academy of Ceramics and Governor of Acta Materialia, Inc. He has authored or coauthored more than two hundred thirty publications, edited forty two books/journal volumes, and holds several patents and technology transfers to industries. He is recipient of numerous (more than forty) national and international awards from all over the world including four R&D 100 awards, NASA Public Service Medal, and NASA Exceptional Space Act Award for outstanding and extraordinary contributions to various NASA programs.
Tatsuki Ohji, PhD, FACerS, is the Prime Senior Research Scientist at Japan's National Institute of Advanced Industrial Science and Technology (AIST). His research interests include characterization of ceramics, ceramic composites and porous materials, design of advanced ceramics, and green ceramic manufacturing. He has authored or coauthored more than 320 scientific papers and nine books, and holds more than forty patents. He is a fellow of the American Ceramic Society, Academician of the World Academy of Ceramics, a Governor of Acta Materialia, Inc., and editorial board member of many international journals.
Rajiv Asthana, PhD, FASM, is a professor at the University of Wisconsin-Stout where he teaches in the manufacturing engineering and engineering technology programs. His research interests include ceramic/metal joining, high-temperature capillarity and cast metal-matrix composites. He is the author or coauthor of four books and 150 refereed papers, an Associate Editor of Journal of Materials Engineering & Performance, guest editor and editorial board member of several refereed journals, and a fellow of ASM International.
Sanjay Mathur, PhD, is professor at the Institute of Inorganic Chemistry at the University of Cologne, Germany. The major research thrust of his group include chemical synthesis of functional nanostructures and their processing for product and device applications. He was an Alexander von Humboldt Fellow at the Saarland University, where he accomplished his Habilitation. He has authored or coauthored over 150 publications, edited a book, holds several patents, and is and Associate Editor of International Journal of Applied Ceramic Technology and Nanomaterials.
Table of Contents
Preface | p. ix |
Contributors | p. xi |
Part I Introduction | p. 1 |
1 Ceramic Integration Across Length Scales: Technical Issues, Challenges, And Opportunities | p. 3 |
Part II Science And Technology For Macroscale Integration | p. 15 |
2 Ceramic Component Integration By Advanced Brazing Technologies | p. 17 |
3 Joining And Integration Issues of Ceramic Matrix Composites For The Nuclear Industry | p. 39 |
4 Air Brazing: A New Method of Ceramic-Ceramic And Ceramic-Metal Joining | p. 91 |
5 Difusion Bonding of Silicon Carbide As An Enabling Technology For The Fabrication of Complex-Shaped Ceramic Components | p. 143 |
6 Integration of Carbon-Carbon Composite To Metallic Systems For Thermal Management Applications | p. 163 |
7 contact Interaction In Carbon-Metal Systems ForJoining And Integration | p. 193 |
part III integration Issues In Energy Generation And Device Fabrication | p. 231 |
8 integration Technologies For Ferrites And Power Inductors In Ceramic Circuit Boards | p. 233 |
9 oxide Thermoelectric Power Generation | p. 267 |
10 integration Technologies For Solid Oxide Fuel Cells (Sofcs) And Other Electrochemical Reactors | p. 297 |
11 integration Technologies For Sensors | p. 323 |
12 on-Chip Integration Of Functional Hybrid Materials And Components In Nanophotonics And Optoelectronics | p. 339 |
13 Integration Of Multifunctional Properties In Thermal Barrier Coatings By Chemical Vapor Deposition | p. 393 |
14 the Changing Physics In Metal Interconnect Reliability | p. 415 |
15 integration Issues Of Barium Strontium Titanate Thin Film For Tunable Microwave Applications | p. 449 |
16 aerosol Deposition (Ad) Integration Techniques And Their Application To Microdevices | p. 489 |
part IV nano- And Biointegration | p. 521 |
17 Advances In Nano Integration Methodologies: Patterning, Positioning, And Self-Assembly | p. 523 |
18 Integration Of Nanowires In New Devices And Circuit Architectures: Recent Developments And Challenges | p. 575 |
19 Integrating Diamond-Like Carbon Into Nanostructure Designs (Fabricating Microscale And Nanoscale Architectures Of Diamond-Like Carbqn Films) | p. 641 |
20 Synthesis, Properties, Integration, And Applications Of Vertically Aligned Ceramic Nanostructures | p. 671 |
21 Nanointegration Based On Thin-Film Technology | p. 699 |
22 mass-Manufacturable Nanowire Integration: Challenges And Recent Developments | p. 721 |
23 Usability Of Ink-Jet Printing Technology And Nanomaterials In Electrical Interconnections, Electronic Packaging, And System Integration For Microelectronics Applications | p. 743 |
24 biointegration Of Prosthetic Devices | p. 777 |
Index | p. 803 |