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Cover image for Progress in abrasive and grinding technology : special topic volume with invited papers only
Title:
Progress in abrasive and grinding technology : special topic volume with invited papers only
Publication Information:
Switzerland : Trans Tech Pubn., 2009
Physical Description:
viii, 196 p. : ill. ; 25 cm.
ISBN:
9780878493425
Added Author:

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30000010222144 TJ1296 P76 2009 Open Access Book Book
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30000010237270 TJ1296 P76 2009 Open Access Book Book
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Summary

Summary

Volume is indexed by Thomson Reuters BCI (WoS).The grinding and abrasive processing of materials are machining techniques which use bonded or loose abrasives to remove material from workpieces. Due to the well-known advantages of grinding and abrasive processes, advances in abrasive and grinding technology are always of great import in enhancing both productivity and component quality. In order to highlight the recent progress made in this field, the editor invited 21 world-wide contributions with the aim of gathering together all of the achievements of leading researchers into a single publication.


Table of Contents

Berend Denkena; Luis de Leon; B. Wang; Dennis HahmannHan HuangWei Long Cong; Peng Fei Zhang; Zhi Jian PeiJun WangMustafizur Rahman; A. Senthil Kumar; I. BiswasMichael N. Morgan; V. Baines-JonesH. Kasuga; Hitoshi Ohmori; Y. Watanabe; T. MishimaJunichi Tamaki; Akihiko KuboY. Chen; Liang Chi ZhangKui Liu; S.T. Ng; K.C. Shaw; G.C. LimXun ChenH.S. Qi; B. Mills; Xi Peng XuTakeshi TanakaWei Min Lin; T. Kato; Hitoshi Ohmori; Eiji OsawaH. Kasuga; Hitoshi Ohmori; Wei Min Lin; Y. Watanabe; T. Mishima; Toshiro K. DoiFei Hu Zhang; Xiao Zong Song; Yong Zhang; Dian Rong LuanXi Peng Xu; X.W. Zhu; Yuan LiPei Lum Tso; Cheng Huan ChenG.F. Zhang; Bi Zhang; Zhao Hui DengCheng Yong Wang; P.X. Yang; Jing Ming Fan; Yue Xian SongHui Huang; N. Guo; Xi Peng Xu
Development in the Dressing of Super Abrasive Grinding Wheelsp. 1
High Speed Grinding of Advanced Ceramics: A Reviewp. 11
Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Reviewp. 23
A Focused Review on Enhancing the Abrasive Waterjet Cutting Performance by Using Controlled Nozzle Oscillationp. 33
A Review of Electrolytic In-Process Dressing (ELID) Grindingp. 45
On the Coherent Length of Fluid Nozzles in Grindingp. 61
Surface Characteristics of Efficient-Ground Alumina and Zirconia Ceramics for Dental Applicationsp. 69
Optimization of Cutting-Edge Truncation in Ductile-Mode Grinding of Optical Glassp. 77
On the Polishing Techniques of Diamond and Diamond Compositesp. 85
Super Polishing Behaviour Investigation of Stainless Steel Optical Lens Moulding Insertsp. 97
Corrective Abrasive Polishing Processes for Freeform Surfacep. 103
Applications of Contact Length Models in Grinding Processesp. 113
Polishing Performance of Electro-Rheological Fluid of Polymerized Liquid Crystal Contained Abrasive Gritp. 123
Study on Tribo-Fabrication in Polishing by Nano Diamond Colloidp. 131
Efficient Super-Smooth Finishing Characteristics of SiC Materials through the Use of Fine-Grindingp. 137
Polishing of Ultra Smooth Surface with Nanoparticle Colloid Jetp. 143
An Experimental Study on High Speed Grinding of Granite with a Segmented Diamond Wheelp. 149
Thinning Silicon Wafer with Polycrystalline Diamond Toolsp. 157
Mechanisms of Al/SiC Composite Machining with Diamond Whiskersp. 165
Effect of Slurry and Nozzle on Hole Machining of Glass by Micro Abrasive Suspension Jetsp. 177
Experimental Investigation of Temperatures in Diamond Wire Sawing Granitep. 185
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