Summary

This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.

Topic coverage includes:
* Failure Analysis Process Flow
* Failure Verification
* Failure Modes and Failure Classification
* Special Devices (MEMS, Optoelectronics, Passives)
* Fault Localisation Techniques: Package Level (NDT)
* Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
* Deprocessing & Imaging Techniques: Deprocessing
* General Imaging Techniques
* Local Deprocessing & Imaging
* Circuit Edit and Design Modification
* Material Analysis Techniques
* Reference Information: Important Topics for Semiconductor Devices
* Failure Analysis Techniques Roadmap
* Failure Analysis Operations and Management
* Appendices: Failure Analysis Terms, Definitions, and Acronyms
* Industry Standards