A note on the calculation of thermal stresses in electronic packaging by finite element methods

Select an Action

Title:

Personal Author:

General Note:

Journal of Electronic Packaging. 111 : 313-320 ; 1989

Subject Term:

Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... PSZ JB	30000010025002	MAK 15227	Open Access Book	Article	Searching... Unknown