Title:
Three-dimensional molded interconnect devices (3D-MID)
Uniform Title:
Räumliche elektronische Baugruppen (3D-MID). English
Personal Author:
Publication Information:
Cincinnati, OH : Hanser Publishers, Munich Hanser Publications, 2014
Physical Description:
xii, 356 pages : illustrations ; 25 cm.
ISBN:
9781569905517
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010335090 | TK7874.53 F73 2014 | Open Access Book | Book | Searching... |
