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1. 
Cover image for Physical design essentials : an ASIC design implementation perspective
2. 
Cover image for Integrated circuit packaging, assembly, and interconnections
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Cover image for Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements
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Cover image for RF measurements of die and packages
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Cover image for Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination
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Cover image for Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination
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Cover image for Chip scale package (CSP): design, materials, processes, reliability, and applications
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Cover image for Microelectronics interconnection and packaging