Cover image for Modeling and extraction of interconnect parameters in very-large-scale integrated circuits
Title:
Modeling and extraction of interconnect parameters in very-large-scale integrated circuits
Personal Author:
Physical Description:
1 reel (positive); 35mm
DSP_DISSERTATION:
Thesis (PhD) - University of Illinois at Urbana-Champaign, 1983

Available:*

Library
Item Barcode
Call Number
Material Type
Item Category 1
Status
Searching...
30000003259482 MFL 1345 Non Circulating Microfilm Microfilm
Searching...

On Order