Cover image for Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes
Title:
Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes
Personal Author:
Publication Information:
2007
Physical Description:
xvi, 109 p. : ill. ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available in CD-ROM : CP 019907 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007

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FKM30000001869 TN690 N67 2007 raf Closed Access Thesis UTM Project Paper (Closed Access)
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30000010176494 TN690 N67 2007 raf Closed Access Thesis UTM Project Paper (Closed Access)
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