Title:
Mechanics of Sn-4Ag-0.5Cu solder joints in a ball grid array assembly during reflow and temperature cycles
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2008
Added Conference Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010212755 | x | Non Circulating UTM Special Collection Materials | 1:BOOK_ARC | Searching... |
