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Cover image for Lead-free implementation and production : a manufacturing guide
Title:
Lead-free implementation and production : a manufacturing guide
Personal Author:
Series:
McGraw-Hill professional engineering
Publication Information:
New York, NY : McGraw-Hill, 2005
ISBN:
9780071443746

Available:*

Library
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Item Category 1
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30000004862730 TK7836 H82 2004 Open Access Book Book
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30000010078553 TK7836 H82 2004 Open Access Book Book
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Summary

Summary

By 2006, any company selling electronics to European Union nations and China will have to convert to a lead-free manufacturing process. This resource shows manufacturers how to select the right Lead Free process and make the conversion as efficient and inexpensive as possible.

Contents: Selecting Component Lead Coating * Selecting PCB Surface Finish * Manufacturing Approaches * Solder Paste Application * Reflow Soldering * Wave Soldering * Other Manufacturing Techniques and Common Defect Consideration * Reliability and Compatibility.


Author Notes

Dr. Jennie Hwang''s wide-ranging career encompasses entrepreneurship, corporate executive, innovative research, world-wide manufacturing and technology services, corporate governance, as well as the leadership positions of professional organizations. She has contributed to technology, business, and academic arenas. Her work is highlighted by numerous national and international awards and honors, as well as by her alma maters'' distinguished Alumni Awards. Among her many awards and honors are the citations by the U.S. Congress and the Ohio Senate/House for her outstanding achievements; membership in the National Academy of Engineering; induction into the Women in Technology International Hall of Fame; and being named a "Star to Watch" by Industry Week magazine; and induction into the Ohio Women''s Hall of Fame. She has held various "woman pioneering" capacities. At her YWCA Women of Achievement Award presentation, her citation read: "Being honored as the FIRST WOMAN is a way of life for Dr. Hwang..., including being the first woman to receive the Ph.D. from the Case Western Reserve University-Materials Science & Engineering ..." Dr. Hwang has extensive hands-on experiences in technology-transfer and bringing innovations to commercialization. She has been a pioneer and major contributor to the electronics surface mount technology establishment since its inception. She is also a highly solicited advisor to industry, government, and universities.

Hwang is the inventor of a number of patents and the author of more than 250 publications including the sole author of several internationally used textbooks and the co-author of several books. As a columnist for SMT magazine, a globally circulated trade magazine, she monthly addresses technology issues and market thrusts; her views are widely solicited and highly regarded worldwide. A popular keynoter and featured speaker at national and international events, she shares her thoughts and vision with various institutions. Her speaking engagements range from commencement keynote speeches at universities to speeches about emerging technologies at the U.S. Patent and Trademark Office (USPTO). Over the years, she has shared her knowledge and experience by delivering professional advancement lectures to over 15,000 professionals and researchers. In addition, she is a prolific author and speaker on education, workforce, trade, and social and business issues. Topics addressed include "Leadership," "Innovation," "Entrepreneurship," "Preparation for New-Millennium Education, Technology, and Workforce", "Education in Science and Engineering," "Modern Manufacturing Workforce," "Asia''s Road to Economic Recovery," "Accelerated Tax Depreciation for High-tech Manufacturing," "Virtual Corporation," "Modern Woman," " Women in Education, Technology, and Workforce," "Affirmative Action," "International Trade and Trade Promotion Authority," "Changes and Coping with Changes," "Welcoming the Digital Economy," and "Technology, Education, Trade, Jobs." As a member of a number of professional organizations, she has served in various capacities, including National President of Surface Mount Technology Association, board trustee of ASM International, and member of the National Research Council/National Materials Board''s Globalization Committee. Her educational background includes a Ph.D. in Engineering from Case Western Reserve University, and two M.S. degrees in Chemistry and Liquid Crystal Science respectively from Columbia University and Kent State University. She also has a bachelor''s in Chemistry.

Dr. Hwang has held various senior executive positions with Lockheed Martin Corporation, Sherwin Williams Company, SCM Corporation, and International Electronic Materials Corporation. Currently, Hwang is the principal of H-Technologies Group, Inc., an intellectual property and service company, providing business and technological solutions to the electronics industry. In addition, she is a distinguished adjunct professor to the Engineering School of Case Western Reserve University, and serves on its Board of Trustees. She also serves on the board of NYSE Fortune 500 companies and the various civic boards.


Table of Contents

Chapter 1 Introduction
Chapter 2 Manufacturing Implementation Approaches
Chapter 3 Selecting Lead-Free Alloys for Solder Interconnections
Chapter 4 Applying Solder Paste
Chapter 5 Selecting Component Coating and PCB Surface Finish
Chapter 6 Applying Mass Reflow Soldering
Chapter 7 Wave Soldering and Selective Soldering
Chapter 8 Compatibility and Cost Considerations
Chapter 9 Other Manufacturing and Common Production Defect Considerations
Chapter 10 Reliability and Accelerated Temperature Cycling Tests
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