Cover image for 2nd ECCC creep conference on creep and fracture in high temperature components : design and life assessment issues, April 21-23, 2009, Zurich, Switzerland
Title:
2nd ECCC creep conference on creep and fracture in high temperature components : design and life assessment issues, April 21-23, 2009, Zurich, Switzerland
Publication Information:
New York : DESTech Publications, 2009
Physical Description:
xviii, 1320 p. : ill. ; 26 cm.
ISBN:
9781605950051

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30000010225871 TA409 E22 2009 Open Access Book Proceedings, Conference, Workshop etc.
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