Title:
Substrate warpage analysis during solder reflow process
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2004
Subject Term:
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004
DSP_RESTRICTION_NOTE:
Restricted until 16th March 2006
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000004814 | TK7874 B43 2004 | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
Searching... | 30000010036344 | TK7874 B43 2004 | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
Searching... | SPS30000001142 | TK7874 B43 2004 raf | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
