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1. 
Cover image for Surfaces, interfaces, and thin films for microelectronics
2. 
Cover image for Thin and thick films for hybrid microelectronics
3. 
Cover image for Sistem kad magnetik; Sifat fizik dan terma kaca oksiklorida berasaskan sistem TeO2-ZnO-ZnCI2; Penyediaan saput tipis timah sulfida (SnS) secara pensulfuran tertudung-tebat; Kesan penggantian argentum dan kalsium dalam bahan superkonduktor YBCO; Penentuan komposisi dan pemalar kekisi c dan a bagi bismuth dalam aloi timah bismuth (SnBi)
4. 
Cover image for The engineering of microelectronic thin and thick films