Cover image for High-power GaAs FET amplifiers
Title:
High-power GaAs FET amplifiers
Personal Author:
Publication Information:
Norwood, MA : Artech House, 1993
ISBN:
9780890064795

Available:*

Library
Item Barcode
Call Number
Material Type
Item Category 1
Status
Searching...
30000002859985 TK7871.58.P6 W25 1993 Open Access Book Book
Searching...

On Order

Summary

Summary

This book is intended for systems engineers, hybrid and monolithic power amplifier designers, engineers involved in the development of CAD programs, academics, and industrial and goverment researchers. The book is devoted exclusively to high power GaAs FET amplifier design, covering the subject comprehensively, including FET design, circuit design, thermal and reliability analysis, and systems applications.


Table of Contents

Prefacep. xi
Chapter 1 Introduction and Basic Theoryp. 1
1.1 Introductionp. 1
1.2 Analysis of Ideal GaAs FET Class A and B Amplifiersp. 3
1.2.1 Device Physics Versus Circuit Design Viewpointp. 3
1.2.2 Class A Amplifiersp. 4
1.2.3 Single-Ended Class B Amplifiers With Resistive Loadp. 11
1.2.4 Single-Ended Class B Amplifiers With Tuned Loadp. 15
1.2.5 Push-Pull Class B Amplifiersp. 18
1.2.6 Comparison of the Various Types of Power Amplifiersp. 21
1.2.7 Validity of the Preceding Analysisp. 21
1.3 The Concept of Power per Millimeter of Gatewidthp. 23
1.4 Small-Signal (Linear) and Large-Signal (Nonlinear) Models for an FETp. 24
1.5 Overview of Design Techniquesp. 30
1.6 Bandwidth Limitations of Reactively Matched Amplifiersp. 35
1.6.1 Output Matching Networkp. 35
1.6.2 Input Matching Networkp. 38
Referencesp. 40
Chapter 2 High-Power GaAs FETsp. 43
2.1 Introductionp. 43
2.1.1 The Development of the High-Power GaAs FETp. 43
2.1.2 Current Technology for the High-Power GaAs FETp. 45
2.2 High-Power FET Design: FET Channel Cross-Section Designp. 48
2.2.1 The Flow of the Design Processp. 48
2.2.2 Designing the Epitaxial Wafer Structurep. 50
2.2.3 Determination of the Gate Lengthp. 56
2.2.4 The Scaling Lawp. 58
2.2.5 Breakdown Voltage and Recess Structurep. 66
2.2.6 Parasitic Resistancep. 72
2.2.7 Equivalent Circuitsp. 74
2.3 High-Power FET Design: FET Pattern Designp. 77
2.3.1 The Flow of the Design Processp. 77
2.3.2 Output Power and Total Gatewidthp. 77
2.3.3 Determination of the Unit Gatewidthp. 80
2.3.4 Chip Sizep. 83
2.3.5 Determination of the Number of Padsp. 84
2.3.6 Pattern Layoutp. 87
2.3.7 Chip Backside Structurep. 90
2.4 Thermal Propertiesp. 94
2.5 Manufacturingp. 97
2.5.1 Epitaxial Wafer Growthp. 97
2.5.2 Flow of the Wafer Manufacturing Processp. 103
2.5.3 Isolationp. 103
2.5.4 Ohmic Electrode Formationp. 105
2.5.5 Gate Electrode Formationp. 108
2.5.6 Protective Layersp. 111
2.5.7 Overlay Wiringp. 112
2.5.8 Backside Processing and Via-Hole Connectionsp. 112
2.6 Evaluationp. 113
2.6.1 Evaluation of dc Characteristicsp. 113
2.6.2 Output Power Measurementp. 114
2.6.3 Measurement of Distortion Featuresp. 118
2.6.4 Impedance Measurement and Load-Pull Measurementp. 120
2.7 Current FETsp. 123
2.7.1 Standard FET Chipsp. 123
2.7.2 Internally Matched FETsp. 128
2.7.3 MMIC Power Amplifiersp. 134
2.8 Trends in Technologyp. 136
2.8.1 Material Technology: The InP MISFETp. 137
2.8.2 The Heterojunction FET: HEMT and Heterostructure MISFETp. 139
2.8.3 The Heterojunction Bipolar Transistorp. 141
2.9 Conclusionp. 142
Referencesp. 143
Chapter 3 Computer-Aided Design of GaAs FET Power Amplifiersp. 147
3.1 Introductionp. 147
3.2 GaAs FET Nonlinear Modelsp. 148
3.2.1 The MESFET Large-Signal RF Equivalent Circuitp. 149
3.2.2 The MESFET Static dc Modelp. 162
3.2.3 General Guidelines for Large-Signal Model Extractionp. 172
3.3 A Large-Signal Amplifier Simulationp. 173
3.3.1 The FLK202XV Large-Signal Modelp. 173
3.3.2 Simulation of the 3.7- to 4.2-GHz, 1-W Class AB Amplifierp. 174
Referencesp. 188
Chapter 4 High-Power GaAs FET Amplifier Designp. 189
4.1 Introductionp. 189
4.2 Budgeting Transmitting Chain RF Performancep. 189
4.3 Performance Characterization and Modelingp. 192
4.3.1 Pulsed RF Testingp. 192
4.3.2 Bias Points and Class of Operationp. 194
4.3.3 Small-Signal Modelingp. 195
4.4 Design Techniquesp. 198
4.4.1 Load-Pullp. 198
4.4.2 Nonlinear CADp. 199
4.4.3 Modified Cripps Methodp. 199
4.5 Scalingp. 204
4.6 Matching Network Designp. 208
4.6.1 Output and Interstage Network Load Line Analysisp. 209
4.6.2 Harmonic Termination Effectsp. 210
4.6.3 Stability Considerationsp. 212
4.7 Thermal Considerationsp. 212
4.8 Gate Current and Insertion Phasep. 215
4.9 Dual-Gate FET Power Amplifierp. 216
Referencesp. 225
Chapter 5 Thermal Effects and Reliabilityp. 227
5.1 Introductionp. 227
5.2 Thermal Fundamentalsp. 228
5.3 Thermal Calculations for Practical FETsp. 229
5.4 Pulsed Operationp. 240
5.5 Measurement of Thermal Resistance and Channel Temperaturep. 243
5.6 Reliabilityp. 248
5.6.1 Failure Mechanismsp. 248
5.6.2 Reliability Statisticsp. 250
5.6.3 Reliability Testingp. 257
5.7 Conclusionp. 260
Referencesp. 260
Chapter 6 Combining Techniquesp. 263
6.1 Introductionp. 263
6.2 Distributed Amplifier Power Combiningp. 264
6.2.1 Small-Signal Analysisp. 264
6.2.2 Effect of Resistive Terminations and Loss Within the FET on Small-Signal Analysisp. 271
6.2.3 Large-Signal Analysisp. 275
6.3 Passive Power Combining/Dividing Networksp. 281
6.3.1 Two-Way In-Phase Power Combiner/Divider Networksp. 282
6.3.2 Two-Way Quadrature-Phase Power Combiner/Divider Networksp. 285
6.3.3 N-Way Power Combiner/Divider Networksp. 289
6.4 Power Combining Methodsp. 292
6.4.1 Corporate Power Combiningp. 292
6.4.2 Serial Power Combiningp. 302
6.4.3 N-Way Power Combiningp. 305
Appendix 6Ap. 307
Referencesp. 311
Chapter 7 Systems Applications of GaAs FET Power Amplifiersp. 315
7.1 Introductionp. 315
7.2 Satellite Applicationsp. 316
7.2.1 Reliabilityp. 316
7.2.2 Active Phased Arraysp. 317
7.2.3 Power Combined Amplifiersp. 319
7.2.4 Mobile Tacticalp. 321
7.2.5 Earth Terminalsp. 328
7.3 Terrestrial Telecommunicationsp. 331
7.3.1 Line-of-Sight Linksp. 332
7.3.2 Linearized Amplifiersp. 332
7.4 Radar and EW Applications for High-Power GaAs FET Amplifiersp. 334
Referencesp. 350
About the Authorsp. 353
Indexp. 357