Microwave materials and fabrication techniques

Featuring current technology developments, this text examines every aspect of microwave circuit design and fabrication techniques. Topics covered include: circuit board materials, etching, and packaging.

Author Notes

Thomas S. Laverghetta received his BSEE from Syracuse University and his MSEE from Purdue.

Mr. Laverghetta is a professor in the electrical engineering department at Purdue University researching microwave materials and their characteristics. He was previously a senior engineer with ITT Aerospace. He is a member of the American Society of Engineering Education, the American Consultants League, and the Institute for Interconnecting and Packaging Electronic Circuits, and a Senior Member of the IEEE. He is the author of other four Artech House books, including Microwave Measurements and Techniques (1976), Handbook of Microwave Testing (1981), Solid State Microwave Devices (1987) and Microwaves and Wireless Simplified (1997).

050

Preface	p. ix
Acknowledgments	p. xi
1 Introduction	p. 1
2 Laminates and Substrates	p. 9
2.1 Introduction	p. 9
2.2 Microwave Material Terms	p. 10
2.2.1 Dielectric Constant	p. 10
2.2.2 Anisotropy	p. 12
2.2.3 Dissipation Factor	p. 13
2.2.4 Dielectric Thickness	p. 15
2.2.5 Copper Weight	p. 18
2.2.6 Coefficient of Thermal Expansion (CTE)	p. 29
2.2.7 Peel Strength	p. 30
2.3 Microwave Material History	p. 31
2.4 Teflon Fiberglass Materials	p. 34
2.5 Non-Teflon Materials	p. 38
2.6 Thermoset Polymer Composites	p. 39
2.7 Polyester Materials	p. 40
2.8 Alumina Substrates	p. 41
2.9 Sapphire, Quartz, and Beryllia Substrates	p. 43
2.10 Material Specifications	p. 43
2.11 UL Requirements	p. 46
2.12 Choice of Materials	p. 48
2.13 Chapter Summary	p. 50
3 Metals	p. 51
3.1 Introduction	p. 51
3.2 Aluminum	p. 53
3.3 Copper	p. 56
3.4 Silver	p. 58
3.5 Gold	p. 59
3.6 Miscellaneous Metals	p. 60
3.6.1 Indium	p. 62
3.6.2 Tin	p. 63
3.6.3 Lead	p. 64
3.6.4 Kovar and Invar	p. 65
3.7 Metal Applications	p. 66
3.8 Chapter Summary	p. 67
4 Microwave Artwork	p. 69
4.1 Introduction	p. 69
4.2 Initial Layout	p. 71
4.3 Final Layout	p. 76
4.4 Chapter Summary	p. 86
5 Etching and Plating Techniques	p. 87
5.1 Introduction	p. 87
5.2 Etching Techniques	p. 88
5.2.1 Cleaning	p. 88
5.2.2 Photoresists	p. 91
5.2.3 Artwork Placement and Exposure	p. 95
5.2.4 Etching	p. 99
5.3 Plating and Plated-Through-Holes	p. 106
5.3.1 Plating	p. 106
5.3.2 Plated-Through-Holes	p. 111
5.4 Alternate Methods of Producing Circuit Boards	p. 112
5.5 Chapter Summary	p. 113
6 Bonding Techniques	p. 115
6.1 Introduction	p. 115
6.2 Solder	p. 116
6.3 Epoxy	p. 126
6.4 Bonds	p. 134
6.4.1 Thermocompression Bonding	p. 135
6.4.2 Ultrasonic Bonding	p. 141
6.4.3 Thermosonic Bonding	p. 143
6.5 Component and Substrate Attachment	p. 144
6.6 Chapter Summary	p. 149
7 Microwave Packaging	p. 151
7.1 Introduction	p. 151
7.2 Microstrip Package	p. 158
7.3 Stripline Packaging	p. 167
7.4 Package Sealing	p. 173
7.5 Microwave Connectors	p. 174
7.6 EMI Considerations	p. 175
7.7 Chapter Summary	p. 177
Appendix A Dielectric Constants	p. 179
Appendix B Coefficients of Expansion	p. 181
Appendix C Chemical Symbols	p. 183
Appendix D Melting Points	p. 185
Appendix E Temperature Conversion	p. 187
Appendix F Data Sheets for Microwave Laminates	p. 191
Appendix G Microwave Connectors	p. 265
Bibliography	p. 271
About the Author	p. 277
Index	p. 279

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