Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model

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Title:

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model

Personal Author:

Aliff Farhan Mohd. Yamin, 1986-

Publication Information:

2012

Physical Description:

xviii, 92 p. : ill. (some col.) ; 30 cm.

General Note:

Also available in CD-ROM : CP 031876 ra

Supervisor : Prof. Dr. Mohd. Nasir Tamin

Subject Term:

Electronic apparatus and appliances -- Reliability

Joints (Engineering) -- Reliability

Solder and soldering

Added Author:

Mohd. Nasir Tamin, supervisor

Added Corporate Author:

Fakulti Kejuruteraan Mekanikal

DSP_DISSERTATION:

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012

Available:*

Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... FKM Library	32000000000209	TK7870.15 A45 2012 raf	Closed Access Thesis	UTM Master Thesis (Closed Access)	Searching... Unknown
Searching... Perpustakaan Raja Zarith Sofiah	30000010319653	TK7870.15 A45 2012 raf	Closed Access Thesis	UTM Master Thesis (Closed Access)	Searching... Unknown
Searching... SPS Library	SPS30000003735	TK7870.15 A45 2012 raf	Closed Access Thesis	UTM Master Thesis (Closed Access)	Searching... Unknown

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