Title:
Fatigue of Sn-4Ag-0.5 Cu solder joints during cyclic bending of a BGA assembly
Uniform Title:
Makalah
Personal Author:
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2009
Added Conference Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010208883 | xx | Non Circulating UTM Special Collection Materials | Article | Searching... |