Title:
Analysis of a wire bonding machine's signature using autocorrelation
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2001
DSP_DISSERTATION:
Project Paper (Bachelor of Electrical Engineering (Mechatronic)) - Universiti Teknologi Malaysia, 2001
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000004792713 | TK5102.5 A92 2001 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
