Cover image for Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM
Title:
Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2003
Physical Description:
1 reel : negatif ; 35mm.
General Note:
5 titles on 1 microfilm
Added Author:
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

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30000010086056 MFL 12649 Non Circulating Microfilm Microfilm
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