Cover image for Fatigue lives of solder joints subjected to accelerated temperature and mechanical load cycles
Title:
Fatigue lives of solder joints subjected to accelerated temperature and mechanical load cycles
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2007

Available:*

Library
Item Barcode
Call Number
Material Type
Item Category 1
Status
Searching...
30000010172186 xx Non Circulating UTM Special Collection Materials Article
Searching...

On Order