Title:
Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method
Personal Author:
Publication Information:
2008
Physical Description:
xv, 73 p. : ill. ; 30 cm.
General Note:
Suupervisor : Dr. Nazri Kamsah
Also available in CD-ROM : CP 027013 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Automotif)) - Universiti Teknologi Malaysia, 2008
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000005278 | TK7870.16 N67 2008 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010204012 | TK7870.16 N67 2008 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
