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Cover image for Effect of moisture diffusion on the interfacial stress of the printed circuit board
Title:
Effect of moisture diffusion on the interfacial stress of the printed circuit board
Publication Information:
2011
Physical Description:
xi, 74 p. : ill. ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Nazri Kamsah
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2011

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FKM30000006518 XX(774891.1) Closed Access Thesis UTM Project Paper (Open Shelves)
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30000010271109 TK7868.P7 N87 2011 raf Closed Access Thesis UTM Project Paper (Closed Access)
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