Cover image for An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures
Title:
An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures
Personal Author:
Nazri Kamsah
Publication Information:
Hampshire : University of New Hampshire, 2001
Subject Term:
Semiconductors -- Junctions

Materials at high temperatures
DSP_DISSERTATION:
Thesis (PhD) in Mechanical Engineering - University of New Hampshire, 2001

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 30000004528265 TK7870.15 N39 2001 Closed Access Thesis UTM PhD Thesis (Closed Access)
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