Cover image for Simulation of thermal strains development in microelctronics package
Title:
Simulation of thermal strains development in microelctronics package
Publication Information:
2009
Physical Description:
xvi, 83 p. : ill. ; 30 cm.
General Note:
Supervisors : Dr. Nazri Kamsah

Also available in CD-ROM : CP 029110 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009

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FKM30000006494 Closed Access Thesis UTM Project Paper (Closed Access)
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30000010227535 TA418.58 N87 2009 raf Closed Access Thesis UTM Project Paper (Closed Access)
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