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1. 
Cover image for A note on the calculation of thermal stresses in electronic packaging by finite element methods
2. 
Cover image for Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies
3. 
Cover image for Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies
4. 
Cover image for Chip scale package (CSP): design, materials, processes, reliability, and applications