by
Morris, James E., 1944-
Author
Morris, James E., 1944-, State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division
Format:
Call Number
TK7870.15E53 1990
Publisher
Van Nostrand Reinhold,
Publication Date
2020 2019 2018 2017 2016
ISBN
9780442001780 9780442004767
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International Conference on High Performance Electronic Packaging (1990 : London, UK)
Author
International Conference on High Performance Electronic Packaging (1990 : London, UK), Johnson, Keith (Keith I.), Welding Institute, Institution of Electrical Engineers (Great Britain), Institute of Physics (Great Britain)
Format:
Call Number
TK7870.15 I34 1990 f
Publisher
Abington,
Publication Date
1991
ISBN
9781855730311
Holds:
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Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka-ken, Japan)
Author
Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka-ken, Japan), Nogita, Kauhiro, editor, Mohd. Arif Anuar Mohd. Salleh, editor, Mohd. Mustafa Al Bakri Abdullah, editor, Liyana Jamaludin, editor
Format:
Call Number
TK7870.15 E443 2018
Publication Date
2018
ISBN
9783035713244
Holds:
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International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Author
International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China), Wu, Yanwen
Format:
Call Number
TK7869 I58 2011
Publisher
Trans Tech Publications,
Publication Date
2011
ISBN
9780878492138
Holds:
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by
Society of Automotive Engineers
Author
Society of Automotive Engineers, SAE World Congress (2004 : Detroit, Michigan)
Format:
Call Number
TL272.5 S63 2004
Publisher
SAE,
Publication Date
2004
ISBN
9780768013931
Holds:
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