Title:
Reliability of electronic packages and semiconductor devices
Personal Author:
Series:
Electronic packaging and interconnection series
Publication Information:
New York : McGraw-Hill, 1997
ISBN:
9780070170247
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000003842055 | TK7871.85 D53 1997 | Open Access Book | Book | Searching... |
On Order
Summary
Summary
This text looks at predicting and extending the functional life of semiconductor components. Using empirical modelling, the author covers major types of failure mechanisms that can greatly reduce the active life of semiconductor components, including interconnection fatigue and electromigration.
Table of Contents
| Introduction |
| Packaging |
| Service Stresses |
| Field Environment |
| Test Conditions and Failure Mechanism Acceleration |
| Early Fails |
| Wearout Fails |
| Types of Fail Distributions |
| Failure Mechanisms and Modeling |
| Reliability Testing and Statistical Analysis |
