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1. 
Cover image for Electronics packaging forum : multichip module technology issues
2. 
Cover image for Multichip modules and related technologies : MCM, TAB and COB Design
3. 
Cover image for Introduction to system on package : miniaturization of the entire system
4. 
Cover image for Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies
5. 
Cover image for Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies
6. 
Cover image for Multichip module design, fabrication, and testing